EDAG Engineering GmbH and Bosch Engineering GmbH have signed a memorandum of understanding for project-based collaboration on entire vehicle engineering. With this agreement, the two German enterprises proclaim their desire…
Automotive manufacturer, VinFast has announced its partnership with NXP Semiconductors for VinFast’s next-generation of Automotive applications at this year’s CES exposition. The collaboration supports VinFast’s goal of developing smarter, cleaner…
