Infineon Technologies has launched two new XENSIV barometric air pressure (BAP) sensors: the KP464 and KP466, both targeted at automotive applications.
While the KP464 is primarily designed for engine control management, the KP466 BAP sensor is intended for seat comfort functions.
The KP464 BAP sensors measures atmospheric pressure, which depends on altitude and weather conditions.
The engine management system uses the sensor’s measurement data to calculate the air density and ensures the optimum air-fuel mixture.
This is the key function for improving fuel efficiency and reducing power consumption. With the reduced energy losses emissions of CO2 and other pollutants can be minimized.
The KP464 BAP sensors from Infineon combines density measurement with additional diagnostics, such as manifold air pressure monitoring. Lower power consumption and additional package miniaturization increase device productivity.
With the next generation of the KP466 BAP sensor, Infineon enables seat manufacturers to realize innovative pneumatic seat systems with many additional functions that are particularly comfortable and offer clear technical advantages. For example, the multi-contour seat function allows vehicle occupants to adapt the contour of the seat to their individual needs.
The optimized solution consumes significantly less power and features a miniaturized five-hole housing. The system constantly monitors the pressure status and adjusts the pressure in the cushions according to the current requirements. It does this by using multiple absolute pressure sensors to monitor pressure throughout the system. The Infineon sensors are SPI enabled, allowing the system to communicate efficiently.
Both the KP464 and KP466 BAP sensors are high-performance, high-precision, miniaturized digital absolute pressure sensors based on the capacitive measurement principle. The sensors are qualified for the AEC-Q103-002 standard to meet automotive industry requirements.
As a result, the devices reduce the effort and risk of errors during module and system qualification. They are micromachined on the surface and feature a monolithic integrated signal conditioning circuit. Both devices convert a physical pressure into a 10-, 12- or 14-bit digital value and transmit the information via the SPI interface.
In addition, both sensors can be integrated into a so-called daisy chain, which minimizes the number of connection pins of the communicating microcontroller with any number of pressure sensors used. This is also possible in combination with other Infineon system components.
Furthermore, a temperature sensor is integrated on the chips. Based on the received SPI command, the 10-, 12- or 14-bit temperature information is also transmitted via the SPI interface. Both devices have a special power-down mode that allows the user to further reduce the power consumption of the sensors.
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