Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, is now stocking the HybridPACK™ Drive G2 modules from Infineon Technologies. The HybridPACK Drive G2 modules build on the HybridPACK Drive G1, delivering higher power density while maintaining the same compact module size. The HybridPACK Drive G2 Modules are efficient automotive power modules for traction inverters in electric vehicles (EVs) and hybrid electric vehicles (HEV).
The Infineon HybridPACK Drive G2 modules, now available at Mouser, incorporate Infineon’s next-generation EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET chip technologies for scalable performance. The easy-to-use power modules boast a range of advanced features that enable system cost improvements, including sensor integration options and on-chip temperature sensing. The HybridPACK Drive G2 modules also offer several package enhancements for better performance and product life. Improved pin rivets ensure robustness over the entire temperature range, and a PinFin baseplate allows for direct cooling.
The HybridPACK Drive G2 modules deliver a power range of up to 300 kW within the 750V and 1200V classes. The HybridPACK G2 modules offer improved thermal conductivity and high durability, ideal for harsh environments. The HybridPACK Drive G2 SiC provides superior gate oxide and cosmic ray reliability and reduces inverter losses by two-thirds compared to state-of-the-art IGBT solutions.